The Ministry of Economic Affairs displayed the latest development in two-phase cooling technology for artificial intelligence chips Feb. 18 in Taipei City, highlighting government efforts to advance high-performance computing.
Developed by Hsinchu County-based Industrial Technology Research Institute in northern Taiwan, the technology removes heat through rapid evaporation and condensation of a dielectric liquid. The expanded contact area between the coolant and the chips also accelerates heat conduction to elevate computing efficacy and stability.
According to the MOEA, the two-phase cooling innovation can boost AI chip cooling capacity beyond 1,500 watts, compared to 1,000 watts with current single-phase technology. The ITRI-developed system has successfully applied for field verification from the global integrated circuit design heavyweight Advanced Micro Devices, Inc., the ministry said, adding that if adopted by global data centers, the cooling solution could reduce annual carbon emissions by 50 million tons.
The success is a result of a 2014 MOEA project that encourages advanced industrial technology development, the ministry said. ITRI also receives support enabling it to work with enterprises such as New Taipei City-headquartered Aewin Technologies Co., Ltd. and Giga-Byte Technology Co., Ltd. to establish a complete supply chain pertinent to heat dissipation in order to drive growth in the country’s AI sector.
Such cooling technology further solidifies Taiwan’s leadership in the global AI industry, the MOEA said, adding that the breakthrough will also create a sustainable computing environment while consolidating the country’s key role in international green energy development. (YCH-E)
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